Preparation of the copper-phosphoric coatings and study of their microhardness
Abstract
The paper represents results of obtaining the copper-phosphorus coatings on the surface of various. Technology of applying conductive copper phosphide films on metal and dielectric materials is shown. Surface preparation of metal products was in mechanical treatment, degreasing and etching with a view to expose the structure of the metal and dielectric surface is subjected to a degreasing and etching to provide the necessary roughness. The results showed that the hardness of the copper-phosphorus catings is higher than the hardness of nickel and chromium plating and chemical nickel hardness. The copper-phosphorus coatings produced by low-temperature gas-phase reduction of surface copper sulfate films consist of copper phosphide Cu3P, which imparts increased hardness of coating.
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